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june 2011 doc id 17815 rev 2 1/15 15 ECMF02-2AMX6 common mode filter with esd protection for usb 2.0 and mipi d-phy/mddi interface features very large differential bandwidth > 6 ghz high common mode attenuation: ? -34 db at 900 mhz ? -20 db between 800 mhz and 2.2 ghz very low pcb space consumption thin package: 0.55 mm max lead-free package high reduction of parasitic elements through integration complies with the following standards: iec 61000-4-2 level 4 input and output pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications mobile phones notebook, laptop portable devices pnd description the ECMF02-2AMX6 is a highly integrated common mode filter designed to suppress emi/rfi common mode noise on high speed differential serial buses like mipi d-phy, mddi or usb 2.0. the ECMF02-2AMX6 can protect and filter one differential lane. figure 1. pin configuration (top view) qfn-6l d+ d+ gnd nc d esd -d- esd esd esd www.st.com
characteristics ECMF02-2AMX6 2/15 doc id 17815 rev 2 1 characteristics figure 2. electrical characteristics (definitions) compliant with usb 2.0 high speed sync field test (150 mv diff). table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage (1) iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 20 kv i dc maximum dc current 200 ma t op operating temperature -40 to +85 c t j maximum junction temperature 125 c t stg storage temperature range - 55 to +150 c 1. measurements done on iec 61000-4-2 test bench. for further details see application note an3353. table 2. electrical characteristics (values, t amb = 25 c) symbol test conditions min. typ. max unit v br i r = 1 ma 6 v i rm v rm = 1.5 v per line 100 na r dc dc serial resistance 1.8 2.5
ECMF02-2AMX6 characteristics doc id 17815 rev 2 3/15 figure 7. scc21 common mode attenuation measurements (z 0 com = 45 ) figure 3. sdd21 differential attenuation measurements (z 0 diff = 100 ) figure 4. scc21 common mode attenuation measurements (z 0 com = 50 ) 300k 1m sdd21 (db) 3m 10m 30m 100m 300m 1g 3g -3 -2.8 -2.6 -2.4 -2.2 -2 -1.8 -1.6 -1.4 -1.2 -1 -0.8 -0.6 -0.4 -0.2 0 f(hz) 300k 1m 3m 10m 30m 100m 300m 1g 3g -36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 f(hz) scc21 (db) figure 5. sdd11 / sdd22 differential return loss measurements (z 0 diff = 100 ) figure 6. sdd21 differential attenuation measurements (z 0 diff = 90 ) 300k 1m 3m 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 sdd11 sdd22 f(hz) sdd11 / sdd22 (db) 300k 1m 3m 10m 30m 100m 300m 1g 3g -3 - 2.8 - 2.6 - 2.4 - 2.2 -2 - 1.8 - 1.6 - 1.4 - 1.2 -1 - 0.8 - 0.6 - 0.4 - 0.2 0 f(hz) sdd21 (db) 300k 1m 3m 10m 30m 100m 300m 1g 3g -36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0 f(hz) scc21 (db)
characteristics ECMF02-2AMX6 4/15 doc id 17815 rev 2 figure 10. mipi d-phy low power mode test setup figure 11. low power pulse response - see figure 10 for test setup figure 8. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 9. esd response to iec 61000-4-2 (-8 kv contact discharge) pin 6 pin 5 20 v/div 20 ns/div 50 v/div 20 ns/div c2 c3 82.3 v 112 v pin 6 -71.1 v -115 v pin 5 20 v/div 20 ns/div 50 v/div 20 ns/div c2 c3 generator agilent 81110 pattern mode, f=10mhz, modulation rz, 50 output cmf oscilloscope lecroy 7300a, 1m input 500 mv/div 500 mv/div 200 ns/div 200 ns/div pulse: 50 ns, t r = t f = 5 ns
ECMF02-2AMX6 characteristics doc id 17815 rev 2 5/15 figure 12. usb 2.0 hsync measurement test setup figure 13. usb 2.0 hsync measurement result figure 14. usb 2.0 eye diagram, mask t1 net pc samsung np-n510 left usb output cmf oscilloscope lecroy 7300a usb output usb key 200 mv/div 200 mv/div 5 ns/div 5 ns/div 0.2v/div 342.2ps/div
application schematics ECMF02-2AMX6 6/15 doc id 17815 rev 2 2 application schematics figure 15. mipi d-phy ecmf04-4amx12 ECMF02-2AMX6
ECMF02-2AMX6 application schematics doc id 17815 rev 2 7/15 figure 16. usb 2.0 v bus d- d+ id gnd d+ d+ gnd nc d- d- usb transceiver lftvs10-1f3 esdalc6v1-1u2 micro-usb esd esd esd esd
ordering information scheme ECMF02-2AMX6 8/15 doc id 17815 rev 2 3 ordering information scheme figure 17. ordering information scheme ecmf 02 ? 2 a xxx function esd common mode filter number of lines 02 = 2 lines number of esd protected lines 2 = 2 esd protected lines version package mx6 = qfn-6l
ECMF02-2AMX6 package information doc id 17815 rev 2 9/15 4 package information epoxy meets ul94, v0 lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. qfn-6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.00 0.0008 0.0009 b 0.18 0.25 0.30 0.007 0.010 0.012 d 1.65 1.70 1.75 0.065 0.067 0.069 e 1.45 1.50 1.55 0.057 0.059 0.061 e 0.45 0.50 0.55 0.018 0.020 0.022 l 0.30 0.40 0.50 0.012 0.016 0.020 figure 18. footprint (dimensions in mm) figure 19. marking top view side view d e e b a1 a l 0.25 0.7 0.6 1.9 1.25 kd
package information ECMF02-2AMX6 10/15 doc id 17815 rev 2 figure 20. tape and reel specifications dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.75 1.63 0.22 1.85 kd kd kd
ECMF02-2AMX6 recommendation on pcb assembly doc id 17815 rev 2 11/15 5 recommendation on pcb assembly 5.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 21. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. figure 22. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 236 m 570 m 250m 600 m 7 m 15 m stencil window footprint
recommendation on pcb assembly ECMF02-2AMX6 12/15 doc id 17815 rev 2 5.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particles: powder particle size 20-45 m. 5.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 5.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
ECMF02-2AMX6 recommendation on pcb assembly doc id 17815 rev 2 13/15 5.5 reflow profile figure 23. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 5.6 layout recommendation connection to pcb gnd must be as short as possible to ensure esd remaining voltage and s cc21 performance. figure 24. layout recommendation 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max vias to gnd plane zdiff according to the application
ordering information ECMF02-2AMX6 14/15 doc id 17815 rev 2 6 ordering information for the latest information on available order codes see the product pages on www.st.com. 7 revision history table 4. ordering information order code marking package weight base qty delivery mode ECMF02-2AMX6 kd (1) 1. the marking can be rotated by 90 to differentiate assembly location qfn-6l 3.55 mg 3000 tape and reel 7? table 5. document revision history date revision changes 10-aug-2010 1 initial release. 28-jun-2011 2 added complies with the following standards: , and air discharge parameter in ta b l e 1 . removed figure 6. sdd41 / sdd23 inter-lane differential cross-coupling measurements.
ECMF02-2AMX6 doc id 17815 rev 2 15/15 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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